Latest News

05.2008

We have expanded our SMT Department facilities with the addition of a new X3 Automatic Screen and Stencil Printer. Read more here.

07.2007

Our new Heller Oven uses the most advanced technology to provide higher airflow for enhanced temperature uniformity, repeatability and high-load handling. Read more about the new Heller Oven here.

06.2007

A new Minilab Vapour Phase soldering machine has allowed us to produce a higher quality product. Read more about the Minilab here.

11.2006

FLC has now greatly expanded its manufacturing capacity by adding 2 brand new Samsung CP45-NEO pick and place machines to the SMT production line.

10.2006

FLC Presents: DMX Driver for High Power LED light sources.

02.2004

FLC presents: CL4L Level Sensor IC


PSoC Consultancy Program

FLC Microdesign is an accredited consultant of Cypress PSoC (Programmable System on Chip).

Cyress PSoC

Microchip Partnership Program

FLC Microdesign specializes in designing with Microchip products. Visit the Microchip Technology web site for more information by clicking here.

Microchip

HI-TECH Certified Consultant

FLC Microdesign is HI-TECH Certified Consultant supporting Microchip Technology Inc.

Microchip

Manufacturer of Coolon Products

FLC Microdesign is the manufacturer of Coolon LED Lighting products.

Coolon LED Lighting

FLC Microdesign Pty Ltd
14 Austral Place
Hallam VIC 3803
+613 8681 3633
enquiries@flcmicro.com

Latest News

05.2008

We have expanded our SMT Department facilities with the addition of a new X3 Automatic Screen and Stencil Printer.

The X3 Screen and Stencil Printer incorporates the very latest technology and is completely reliable. Offering optical positioning and automatic incline systems, the many benefits of using this new machine include increased repeat accuracy +/-25mm @ 3Sigma, direct accommodation of stencil frames of various dimensions and a self-cleaning unit, ensuring printing results of a consistently high standard.

07.2007

Our new Heller Oven uses the most advanced technology to provide higher airflow for enhanced temperature uniformity, repeatability and high-load handling.

The 1700EXL features Heller's new, enlarged heating tunnel and baffle-free design, for six-sigma consistency, zone-to-zone and oven-to-oven. It also provides more flexibility in board handling, more robust construction and a more streamlined appearance.

The 1700EXL supports high-speed, high-volume throughput... at speeds up to 32 inches (80 centimeters) per minute. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen.

06.2007

A new Minilab Vapour Phase soldering machine has allowed us to produce a higher quality product.

All soldering processes have one thing in common: They are able to securely attach components onto specified base material. But when it comes to the quality of the processing, process safety and reliability, and therefore in the final analysis to a question a great deal of money, the chaff is separated from the wheat. The fact is: Vapour phase soldering, also known as VP soldering, or vapour phase reflow, is currently the most flexible, simplest and most reliable method of soldering. It is ideally suited for all types of SMD components and base materials. It allows processing of all components without the need of any complicated calculations or having to maintain temperature profiles.

How it works. As the liquid boils, a layer of saturated vapour containing no oxygen or other gasses forms above it. The vapour's weight is high therefore it displaces other gasses. Consequently, a pure protective gas atmosphere (0 ppm oxigen) forms without any additional gasses such as e.g. nitrogen having to be used. If the solder material is immersed into the vapour zone, the vapour condenses on the solder material and transfers its heat. Irrespective of the time the solder material remains in the vapour its temperature can never exceed the vapour's temperature.

The laws of physics determine the framework conditions. The key factor: The temperature of the vapour can never exceed the temperature of the boiling liquid, and it is fixed. The consequence: The solder process can be reliably reproduced and offers ideal conditions for controlling the process. This enables soldering to be carried out on a wide range of assemblies, from flexprint to multi-layer, reliably and without overheating.

Advantage of VP Soldering include:

  • No temperature profiling necessary- the vapor reflows the solder
  • You cannot heat the assembly higher than the condensing vapor temp
  • Repeatable process conditions
  • Uniform temperature across the board
  • Easily switch from lead to lead free soldering
  • Chemistry provides a 100% inert gas atmosphere
  • Oxidation free preheat and soldering
  • Delamination of boards eliminated
  • Low operating costs
  • Little maintenance required